DuPont Tyvek Butyl Tape is a high-performance air and vapour control solution engineered for sealing joints and seams in building envelopes. This 20mm x 30m tape delivers reliable moisture management and airtightness, critical for maintaining thermal performance and preventing interstitial condensation in insulated assemblies.
Key Features
- Butyl-based adhesive provides permanent bond to most substrates
- Superior air and vapour barrier properties for envelope continuity
- 20mm width suited for standard joint sealing applications
- DuPont Tyvek carrier ensures durability and puncture resistance
- UV stable formulation for temporary weather protection during construction